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Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications

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2 Author(s)

The eleven papers in this spection section are devoted to electrical performance analysis and simulation of interconnects, packages and devices composing electronic systems for high-performance applications.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:31 ,  Issue: 4 )