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A Closed-Form Equation for Estimating Capacitance of Signal Vias in Arbitrarily Multilayered PCBs

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1 Author(s)
Pajovic, M.M. ; Cisco Syst. Inc., San Jose, CA

This paper provides a significant improvement to the coaxial-line equation that is used for analytical estimation of via capacitance in multilayered printed circuit boards (PCBs) Previously, a pure coaxial-line equation is used for estimating via capacitance with a maximized and minimized number of pads in high-density multilayered PCBs. Now, in the via capacitance equation, both the capacitances associated to via body and via pads in multilayered PCBs with arbitrary stackups are included. Laboratory measurements by a vector network analyzer and digital inductance-capacitance-resistance (LCR) meter, as well as quasi-static and full-wave computational simulations, confirm solid accuracy of the derived equation used for estimating the capacitance of arbitrary signal via geometry common in practice.

Published in:

Electromagnetic Compatibility, IEEE Transactions on  (Volume:50 ,  Issue: 4 )

Date of Publication:

Nov. 2008

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