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System-in-a-package technology for 3D integration of radar modules

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8 Author(s)
Brebels, S. ; HRFP Group, IMEC, Leuven ; Sun, X. ; Carchon, G. ; Posada, G.
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3D thin-film technology including substrate vias and integrated passives is used as a platform for heterogeneous integration of high frequency wireless systems and radar. The features of the technology are first described and next demonstrated with an integrated Doppler radar operating in the Ku band.

Published in:
Microwaves, Radar and Remote Sensing Symposium, 2008. MRRS 2008

Date of Conference: 22-24 Sept. 2008

Page(s):
112 - 115
E-ISBN :
978-1-4244-2689-8
Print ISBN:
978-1-4244-2688-1
INSPEC Accession Number:
10393873
Conference Location :
Kiev
Digital Object Identifier :
10.1109/MRRS.2008.4669558

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