Close category search window
 

A Modular Approach to Model Heterogeneous MPSoC at Cycle Level

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Monchiero, M. ; HP Labs., Palo Alto, CA ; Palermo, G. ; Silvano, C. ; Villa, O.

This paper proposes a system-level cycle-based framework to model and design heterogeneous multiprocessor systems-on-chip (MPSoC), called GRAPES. The approach features flexibility and modularity maintaining high simulation speed despite modeling at cycle level. Intellectual property (IP) system modules can be described as C++or System C entities and they are wrapped into C++ objects, called plug-ins. Plug-ins, that are modeled by the transaction level modeling (TLM) style, are managed by the GRAPES kernel, which is the core of the simulation framework. GRAPES structural approach permits to easily model run-time reconfiguration and power modeling. Furthermore, GRAPES has been used to model and to simulate a case study: a scalable and heterogeneous MPSoC based on network-on-chip (NoC) interconnect.

Published in:
Digital System Design Architectures, Methods and Tools, 2008. DSD '08. 11th EUROMICRO Conference on

Date of Conference: 3-5 Sept. 2008

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.