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SU-8 micromachining process for millimeter and submillimeter-wave waveguide circuit fabrication

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2 Author(s)
Smith, C.H. ; Univ. of Virginia, Charlottesville, VA ; Barker, N.S.

This paper presents a fabrication technique that utilizes a combination of photolithography and mechanical lapping to achieve a micromachining process to overcome the limitations of conventional machining for realization of millimeter and submillimeter waveguide components. The fabrication process for the waveguide sections begins with spin cleaning a silicon wafer. The SU-8 micromachined part will be assembled to the flange and measurements will be taken of the waveguide sections to characterize the micromachined waveguides.

Published in:

Infrared, Millimeter and Terahertz Waves, 2008. IRMMW-THz 2008. 33rd International Conference on

Date of Conference:

15-19 Sept. 2008