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This paper presents a fabrication technique that utilizes a combination of photolithography and mechanical lapping to achieve a micromachining process to overcome the limitations of conventional machining for realization of millimeter and submillimeter waveguide components. The fabrication process for the waveguide sections begins with spin cleaning a silicon wafer. The SU-8 micromachined part will be assembled to the flange and measurements will be taken of the waveguide sections to characterize the micromachined waveguides.
Date of Conference: 15-19 Sept. 2008