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This novel and revolutionary new approach to printed circuit board testing utilizes nanostructured sensor technology to detect elements of electronic component degradation and failure directly at the circuit board itself, combined with imaging techniques to literally see defects within the circuit board and electronic components. Specific achievements include the development of electronic and chemoresistive sensors based on novel, purpose developed organic materials and the evaluation of their responses to a number of various failure events. Sample collection mechanisms used for the testing procedures are discussed along with the data acquisition processes followed by feature extraction and pattern recognition procedures. Finally, the design of a functional prototype system will also be presented along with the conceptualized integration of the chemical sensor-based off-gassing analysis within a multi-technology fault detection system.