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Applications for GaAs and silicon integrated circuits in next generation wireless communication systems

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1 Author(s)
L. M. Burns ; 3Com Corp., Santa Clara, CA, USA

Emerging applications for portable wireless voice and data communications systems are requiring increased data rates and functionality. Meeting cost and performance goals requires careful attention to system level design and partitioning such that appropriate technologies are employed in cost-effective solutions. New circuit designs and techniques are required to meet size, power, and regulatory restrictions. This provides an exciting opportunity for GaAs, silicon, and passive component technologies. This review paper will discuss factors influencing the choice of which technology is best suited to a particular application and present several system level architectures of radio-based communication systems. The paper will illustrate appropriate applications of GaAs, silicon, and passive integrated circuit technologies. A summary is given that highlights the relative strengths and weaknesses of each technology to date

Published in:

IEEE Journal of Solid-State Circuits  (Volume:30 ,  Issue: 10 )