Referenced Items are not available for this document.
Stabilizing the copper interconnect process is the key to improving yield and reliability. A stable process for forming adequate grains in a copper film is important, but there is no proper method for monitoring the grains in that film. We introduce the micro-haze method, an advanced method for monitoring grain size using scattering light. We experimentally verified the effectiveness of the method and concluded that the method enables the monitoring the grains in a copper film.
Published in:
Semiconductor Manufacturing, IEEE Transactions on
(Volume:21
,
Issue:
4
)
Date of Publication: Nov. 2008
- Page(s):
- 578 - 584
- ISSN :
- 0894-6507
- INSPEC Accession Number:
- 10311696
- Digital Object Identifier :
- 10.1109/TSM.2008.2005354
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 05 November 2008
- Issue Date :
- Nov. 2008
- Sponsored by :
- IEEE Components, Packaging and Manufacturing Technology Society
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