Cart (Loading....) | Create Account
Close category search window
 

Nondestructive detection of defects in miniaturized multilayer ceramic capacitors using digital speckle correlation techniques

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Chan, Y.C. ; Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong ; Fan Yeung ; Guangchang Jin ; Naikong Bao
more authors

The novel application of a digital speckle correlation method (DSCM) was demonstrated for the in situ and nondestructive detection of cracks in small objects such as multilayer ceramic capacitors (MLC's) in surface mount printed circuit assemblies. A combined DSCM and double lens optical arrangement was employed for the measurement of minute surface deformations in MLC's. An improved cross algorithm instead of the original full-field search method was developed based on the unimodal character of the DSCM and reduced the operation time by an order of magnitude without sacrificing the measuring accuracy. The internal cracks in MLC's that contributed to the thermal displacements on the MLC surface after the electrical loading could be uniquely identified using this improved DSCM. This technique was found to be extremely sensitive to the presence of internal cracks in MLC's of different sizes (“1206”, “0805”, “0603”, and “0402”) created by thermal shock and has been shown to be more reliable and user-friendly than other conventional nondestructive techniques. A resolution of better than 20 nanometers in surface deformation measurements is achieved within 0.01 pixel resolution. The location and the size of defects, as obtained from the DSCM, correlate well with destructive physical analyses and surface temperature variation analyses performed on the respective samples

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 3 )

Date of Publication:

Sep 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.