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Investigation of crack propagation in ceramic/conductive epoxy/glass systems

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4 Author(s)
Sheng Liu ; Dept. of Mech. & Aerosp. Eng., Florida Inst. of Technol., Melbourne, FL, USA ; Zhu, J.S. ; Hu, J.M. ; Yi-Hsin Pao

The primary objective of this combined experimental and analytical study was to investigate the mechanical behavior of glass/conductive adhesive/Al2O3 systems with a surface notch, measure the properties of the system at various temperatures, implement these temperature dependent properties into a nonlinear finite element framework, and predict the initiation and growth of cracking. The three major tasks of this work include: (a) testing of fracture strength of the systems at three different temperatures, including the determination of thermal crack initiation and growth, (b) determination of basic thermal-mechanical properties of adhesive, glass, and Al2O 3, respectively, and (c) identification of appropriate quantities to predict damage modes, including initiation and growth, at different temperatures and comparing the data with experiments. The major conclusions are as follows: (a) realistic nonlinear material properties are essential input for correct nonlinear finite element modeling, (b) J-integral can be applied to predict the crack initiation and growth for the material system considered, (c) either bulk glass material or the adhesive/glass interface may fail depending on the applied temperature and notch length, and (d) curved crack growth path inside the glass can be predicted by fracture mechanics

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 3 )