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Electrochemical processes resulting in migrated short failures in microcircuits

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1 Author(s)
Harsanyi, G. ; Dept. of Electron Technol., Tech. Univ. Budapest, Hungary

Metals can exhibit dendritic short-circuits caused by electrochemical migration in conductor-insulator structures, which may result in failures and reliability problems in microcircuits. The classical model of electrochemical migration has been well known for several decades. This process is a transport of metal ions between two metallization stripes under bias through a continuous aqueous electrolyte. Due to the electrodeposition at the cathode, dendrites and dendrite-like deposits are formed. Ultimately, such a deposit can lead to a short circuit in the device and can clause catastrophic failure. A few anomalous and newly discovered phenomena have initiated us to perform some revisions and to add supplementary models to the conventional one. A theoretical review based on practical results is given about the most important possible processes. Material design aspects are also discussed

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 3 )