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Enhancement of a two-phase thermosyphon for cooling high heat flux power devices

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5 Author(s)
H. Kuwahara ; Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan ; K. Takahashi ; T. Nakajima ; T. Takasaki
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The purpose of this study is the enhancement of cooling of high heat flux power devices such as a thyristor by a thermosyphon system. The thermosyphon uses boiling and condensation of an inert dielectric fluorocarbon (FC-72). Boiling occurs from a multiple chimney heat transfer structure. A boiling chamber is connected to the condenser by a double tube, with the inner tube carrying the condensed liquid and the outer annulus carrying vapor. Using the experimental model of a thermosyphon, heat flux capacity is enhanced by increasing the flow tube height H0, boiling chamber height Hh, and condenser liquid level Hl. High heat flux capacity is achieved with H0>8 cm, Hh>10 cm, and Hl >H0, using the chimney heat transfer structure with a channel width of 3 mm. The thermosyphon system is able to cool a maximum heat flux of 3 kW per device

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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:18 ,  Issue: 3 )