By Topic

Thermap: a thermal model for microprocessors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Fitch, J.S. ; Digital Equipment Corp., Palo Alto, CA, USA ; Monier, L. ; Tamet, H.

Thermap is a numerical model that predicts the steady-state temperature of a multilayered stack of materials, which might include voids. Heat flux and temperature can be prescribed at any node. Thermap gathers the heat flux boundary descriptions from a VLSI CAD tool in order to simulate a microprocessor. This can be done with very fine spatial resolution. Thermal conductivities can be temperature dependent. Residual iteration, grid refinement, and efficient use of data structures allow Thermap to converge quickly. A graphical server called ezd is used to view the resulting images of power or temperature. Thermap's temperature predictions are compared with an infrared measurement of a real microprocessor

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 3 )