Cart (Loading....) | Create Account
Close category search window
 

Single-phase and boiling cooling of small pin fin arrays by multiple slot nozzle suction and impingement

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Copeland, D. ; Dept. of Mech. & Intelligent Syst. Eng., Tokyo Inst. of Technol., Japan

Experimental measurements of forced convection single-phase and boiling heat transfer from pin fin arrays were made using fluorocarbon liquid FC-72. Liquid flow was directed to and from the pin fin arrays by multiple slot nozzles, alternately providing suction and impingement flow. Rectangular pin fin arrays having equal width and spacing of 0.1 and 0.2 mm and aspect ratios from 1 to 5 were machined from 1 cm square copper blocks. The multiple slot nozzles featured alternating inlet and outlet channels 1-mm wide on a 2-mm pitch. Flow rates of 1.25 to 10 cm 3/s (0.075 to 0.6 l/min) were tested, resulting in inlet and outlet velocities of 0.05 to 0.4 m/s and pin fin array velocities from 0.05 to 4.0 m/s. The range of flow rates and pin fin geometries provided a single-phase thermal conductance as high as 38.5 kW/m2·K and critical heat flux as high as 369 W/cm2. At a fixed pin fin aspect ratio and liquid flow rate, reducing pin fin width from 0.2 mm to 0.1 mm increased single-phase heat transfer by an average of 7%, while critical heat flux remained constant. Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of liquid flow rate, pin fin aspect ratio and width are provided

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 3 )

Date of Publication:

Sep 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.