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Review of non contact thermal mapping methods for electronic systems application

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3 Author(s)
S. R. Ailani ; Department of Electrical and Computer Engineering, Ryerson University, 350 Victoria St. M5B 2K3, Toronto, ON, Canada ; M. C. E. Yagoub ; F. A. Mohammadi

Silicon die surface and PCBs surface temperature can be used to monitor the health state of analog and digital integrated circuits. In present paper, different non contact temperature distribution techniques have been reviewed in detail from accuracy, reliability, complexity and industrial usability point of view. The methods discussed here are Infrared thermography, Interferometry and Thermoreflectance.

Published in:

Telecommunications, 2008. IST 2008. International Symposium on

Date of Conference:

27-28 Aug. 2008