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Characterization of Equalized and Repeated Interconnects for NoC Applications

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2 Author(s)
Byungsub Kim ; Electr. Eng. & Comput. Sci. Dept., Massachusetts Inst. of Technol., Cambridge, MA, USA ; Stojanovic╠ü, V.

As the number of cores increases and onand off-chip bandwidth demand rises, it is becoming increasingly more difficult to rely on conventional interconnects and remain within the chip power budget. This article explores leveraging equalization for global and semi-global long interconnects to overcome this problem.

Published in:

Design & Test of Computers, IEEE  (Volume:25 ,  Issue: 5 )