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Pattern recognition for automated wire bonding

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3 Author(s)
Li, H.F. ; University of Hong Kong, Electrical Engineering Department, Hong Kong, Hong Kong ; Tsang, C.M. ; Cheung, Y.S.

The design and development of an integrated pattern-recognition system for transistor/LED wire bonding is presented. The system uses a M6809 microprocessor for computation. Three recognition algorithms are studied extensively, and their relative performances are compared. The first algorithm based on edge extraction and projection is relatively slow but is a candidate for hardware implementation at higher speeds. The second algorithm based on the Freeman tracer is the fastest, but not intelligent enough to identify connected regions. A new algorithm called the `connected-tracerĂ‚Â¿ algorithm is proposed, which solves the problem of simple connectiveness with a speed performance of around 0.1 s using a 1 MHz processor. A variety of die samples of different sizes, scribing and attachment methods are tested. The results indicate that the system developed is both reliable and effective for fully automated transistor/LED wire bonding

Published in:

Computers and Digital Techniques, IEE Proceedings E  (Volume:131 ,  Issue: 1 )