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The paper presented the IEC 61499 based run-to-run controller for chemical mechanical planarization process. Experiments show the needs of adjust the removal rate based on the actual data captured from manufacturing line rather than default values to calculate removal rate for every lot and use removal rate to calculate polish time for the next lot which would be polished next in the polish tool. Two key components of the controller namely removal rate calculation and polish time calculation was developed and the result from both components was captured and analyzed.
Date of Conference: 15-18 Sept. 2008