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A novel thin-overcladding spot-size converter for efficient silicon-wire optical interconnections and waveguide circuits

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6 Author(s)
Yoshida, H. ; Corp. R&D Center, Toshiba Corp., Kawasaki ; Sato, T. ; Ohira, K. ; Hashimoto, R.
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We present a novel inverse-taper spot-size converter with submicron-thick overcladding for silicon-based optical interconnections and waveguide circuits. Utilizing this structure, a flying-junction underpass silicon-wire cross-connect on a silicon-on-insulator (SOI) wafer is demonstrated.

Published in:

Group IV Photonics, 2008 5th IEEE International Conference on

Date of Conference:

17-19 Sept. 2008