By Topic

3-D Measurement of Solder Paste Using Two-Step Phase Shift Profilometry

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Tak-Wai Hui ; Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong ; Grantham Kwok-Hung Pang

A two-step phase shift profilometry method (2-step PSP) with prefiltering and postfiltering stages is proposed to reconstruct the 3-D profile of solder paste. Two sinusoidal patterns which are pi-out-of-phase are used in the 3-D reconstruction. The new method uses only two fringe patterns rather than four as the four-step phase shift profilometry (4-step PSP). In Fourier transform profilometry (FTP), a bandpass filter is required to extract the fundamental spectrum from the background and higher order harmonics due to camera noise and imperfectness of the pattern projector. By using two pi-out-of-phase sinusoidal fringe patterns, the background term can be eliminated directly by taking the average of the two fringe patterns. The fringe pattern which is close to its ideal form can also be recovered from the averaging process. Prefiltering is utilized in filtering raw images to remove noise causing higher order harmonics. Hilbert transform is then used to obtain the in-quadrature component of the processed fringe pattern. Postfiltering is applied for reconstructing an appropriate 3-D profile.

Published in:

IEEE Transactions on Electronics Packaging Manufacturing  (Volume:31 ,  Issue: 4 )