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In this paper, silver powders with a uniform particle size of 0.2-0.4 mum and an excellent dispersibility were applied to produce a conductive ink for the inkjet printing process. The thermal behaviors of silver particles sintered at different temperature were investigated through X-ray diffraction (XRD) patterns. It was found out that both the particle size and crystal grains increase during the surface diffusion and sintering process. A drop-on-demand (DOD) inkjet printing system was employed to print the conductor by using as-mentioned silver particles suspended in terpineol/polyketone (PK) system as conductive materials. The optimized value of WPK/Wsilver was 5%, corresponding to a resistivity of 2.0 muOmega ldr cm. It was revealed that an increase in the WPK/Wsilver ratio resulted in the increase in both the resistivity and adhesion strength of the conductor. The scanning electron microscopy (SEM) analysis based on the microstructures of silver conductor further illustrates that the densification of conductor and long-range interparticle connectivity ensure the silver conductor a low resistivity. The adhesiveness effect from PK resin enables the conductor a high adhesion strength.
Electronics Packaging Manufacturing, IEEE Transactions on (Volume:31 , Issue: 4 )
Date of Publication: Oct. 2008