By Topic

Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Ching-I. Chen ; Mech. Eng., Chung Hua Univ., Hsinchu ; Ching-Yu Ni ; Chi-Min Chang ; Shao-Chiun Wu
more authors

Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape and Au bumps on a driver IC chip to form electrical paths. With the newly developed film carrier assembly technology, called chip on film (COF), the bumps are prepared separately on a film tape substrate and bonded on the finger lead ends beforehand; therefore, the assembly of IC chips can be made much simpler and cheaper. In this paper, three kinds of COF samples, namely forming, wrinkle, and flat samples, were prepared using conventional gang bonder. The peeling test was used to examine the bondability of ILB in terms of the adhesion strength between the inner leads and the bumps. According to the peeling test results, flat samples have competent strength, less variation, and better appearance than when using flip-chip bonder.

Published in:

IEEE Transactions on Electronics Packaging Manufacturing  (Volume:31 ,  Issue: 4 )