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In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing

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4 Author(s)
Davis, C.E. ; Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD ; Dickherber, A.J. ; Hunt, W.D. ; May, G.S.

Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20degC to 300degC with an attainable accuracy of plusmn2 degrees.

Published in:

Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:31 ,  Issue: 4 )

Date of Publication:

Oct. 2008

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