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In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing

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4 Author(s)
Cleon E. Davis ; Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD ; Anthony J. Dickherber ; William D. Hunt ; Gary S. May

Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20degC to 300degC with an attainable accuracy of plusmn2 degrees.

Published in:

IEEE Transactions on Electronics Packaging Manufacturing  (Volume:31 ,  Issue: 4 )