By Topic

Characterization and thermal analysis of a 48 V GaN HFET device technology for wireless infrastructure applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

12 Author(s)
B. M. Green ; Freescale Semiconductor, Inc., 2100 E. Elliot Rd. MD EL720, Tempe, Arizona 85284, USA ; H. Henry ; J. Selbee ; F. Clayton
more authors

This report presents the DC, pulsed I-V, small signal, and large signal characteristics of Freescalepsilas 48 V GaN HFET technology. Characterization of large signal performance for a 12.6 mm at 48 V drain bias shows 89 W output power with an associated power density of 7.1 W/mm, linear gain of 17.5 dB, and a power-added efficiency (PAE) of 62%. Analysis of channel temperature over drain bias shows that the maximum channel temperatures at 28 V and 48 V are 107 degC and 245 degC, respectively during saturated RF operation. Data for RF drift over time on a 16.2 mm device show less than 0.2 dB of RF drift for >1000 hrs. of testing. This level of RF performance represents a significant >4 dB gain and >2 W/mm power density improvement over Freescalepsilas previously reported GaN HFET technology.

Published in:

Microwave Symposium Digest, 2008 IEEE MTT-S International

Date of Conference:

15-20 June 2008