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Fabrication and Thermal Analysis of Wafer-Level Light-Emitting Diode Packages

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7 Author(s)
Jeung-Mo Kang ; LED R&D Lab., LG Electron. Inst. of Technol., Seoul ; Jeong-Hyeon Choi ; Du-Hyun Kim ; Jae-Wook Kim
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Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance and junction temperature are investigated using both serial and matrix measurement methods.

Published in:

Electron Device Letters, IEEE  (Volume:29 ,  Issue: 10 )