By Topic

\hbox {HfO}_{2} Gate Breakdown and Channel Hot Electron Effect on MOSFET Third-Order Intermodulation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yuan, J.-S. ; Nanoelectron. Reliability Lab., Univ. of Central Florida, Orlando, FL ; Chuanzhao Yu

The effect of n-channel hot electron and p-channel gate oxide breakdown (BD) on the third-order intermodulation of HfO2 MOS transistors has been studied. Both reliability physics mechanisms result in a similar shift of the intermodulation intercept point characteristics versus the absolute value of gate-source voltage. However, the device VIP3 in the subthreshold region is sensitive to BD leakage current and BD location effect. The third-order input intercept point as function of stress time was evaluated experimentally and compared with the analytical model predictions. A good agreement between the model predictions and experimental data is obtained.

Published in:

Electron Devices, IEEE Transactions on  (Volume:55 ,  Issue: 10 )