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POD: A 3D-Integrated Broad-Purpose Acceleration Layer

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5 Author(s)
Dong Hyuk Woo ; Georgia Inst. of Technol., Atlanta, GA ; Lee, H.-H.S. ; Fryman, J.B. ; Knies, A.D.
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To build a future many-core processor, industry must address the challenges of energy consumption and performance scalability. A 3D-integrated broad-purpose accelerator architecture called parallel-on-demand (POD) integrates a specialized SIMD-based die layer on top of a CISC superscalar processor to accelerate a variety of data-parallel applications. It also maintains binary compatibility and facilitates extensibility by virtualizing the acceleration capability.

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Micro, IEEE  (Volume:28 ,  Issue: 4 )