By Topic

Thermal Analysis of a Novel Compact Packaged Passively Cooled Laser Diode Array

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Cong Yin ; Center for Photonics & Electron., Tsinghua Univ., Beijing ; Lei Huang ; Fahong He ; Gong, Mali

The temperature of a laser diode array chip must be maintained under a safe level during operation in order to achieve satisfactory performance and lifetime. In this paper, 3-D thermal analysis on diode heatsink is presented. The boundary condition at the bottom of heatsink is constant convective heat transfer coefficient. In addition, heat transfer in thermal-entry region of tubes is accounted for to calculate the convective heat transfer coefficient. Moreover, a 12 mm times 37 mm times 7 mm passively cooled laser diode array cooled by a base heatsink is demonstrated. Up to 62 W output power with an electrical-to-optical conversion efficiency of 49.2% are achieved. System thermal resistance of 0.77 K/W is obtained when the flow rate through the base heatsink with 0.8-mm-wide, 2-mm-high and 20-mm-long channels is 25 cm3/s.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:31 ,  Issue: 3 )