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3D stacking and integration can provide system advantages. This paper explores an application driver for 3D ICs. Interconnect-rich applications especially benefit, sometimes up to the equivalent of two technology nodes. Another promising application area is that of logic-on-memory. This paper presents a case studies of an 8192-point fast Fourier transform (FFT) processor in order to quantify the benefit of the through-silicon vias in an available 180 nm 3D process. The FFT shows a 22% reduction in cycle-time, coupled with an 18% reduction in energy per transform.