By Topic

Research on effect of measured curvature on eddy current evaluation by finite element analysis

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yu Yating ; School of Mechatronics Electronics Engineering, University of Electronic Science and Technology of China, ChengDu, China, 610054 ; Du Pingan ; Shi Mingquan

Presently, eddy current evaluation has been used in many engineering fields, such as flaw or cracks testing, distance measurement, and material properties measurement. However, eddy current testing is sensitive to multiple parameters, e.g. the sensor lift-off, and the measured curvature, the electromagnetic properties of measured. In this paper, the finite element model of sensor under spheroid and cylinder are built firstly. Then the finite element formulation of coil impedance is carried out. Finally, the effect of the measured curvature on the planar coil impedance, the electromagnetic field distribution of sensor, the eddy current distribution in measured are investigated by finite element analysis, respectively. The conclusions are shown that (1) whenever the measured is convex or concave, the effect trend of measured curvature is almost the same under the nonmagnetic measured; (2) the influence of the measured curvature is different when the measured is magnetic. Therefore, it is necessary to take different measures to correct the curvature effects on different measured.

Published in:

Industrial Technology, 2008. ICIT 2008. IEEE International Conference on

Date of Conference:

21-24 April 2008