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Simulation on thermal characteristics of LED chips for design optimization

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5 Author(s)
Ting Cheng ; Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol, Wuhan ; Xiaobing Luo ; Suyi Huang ; Zhiyin Gan
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As thermal performance is importance for high-power LED devices, there exists a need to build a validated model to clarify the thermal transfer mechanisms in the LED chip in terms of the chip materials and structures. High-power LED was numerically investigated using the finite element method. A series of substrate materials with different thermal conductivity and thicknesses were studied. The impact of varying cooling capacities on chip junction temperature is also presented.

Published in:

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Date of Conference:

28-31 July 2008