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As thermal performance is importance for high-power LED devices, there exists a need to build a validated model to clarify the thermal transfer mechanisms in the LED chip in terms of the chip materials and structures. High-power LED was numerically investigated using the finite element method. A series of substrate materials with different thermal conductivity and thicknesses were studied. The impact of varying cooling capacities on chip junction temperature is also presented.
Date of Conference: 28-31 July 2008