Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Methodology for modeling simultaneous switching noise in BGA packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Song Li ; Wuhan Univ. of Technol., Wuhan ; Xue-tao Weng

Advances in BGA packaging technologies have led to a dramatic increase in the performance of integrated circuits. Noise source such as supply bounce, signal coupling, and reflections results in reduced performance. The work presents techniques to model and improve performance the performance of BGA designs without moving toward advanced packaging. A single, unified mathematical framework is presented that predicts the performance of a given package depending on the package parasitics. Using 3-Bit Bus example about the package, a methodology is presented to analyse mutual inductive signal coupling and mutual capacitive signal coupling and return current. The performance model illustrate that the per-pin performance is significantly reduced, where the number of switching signals is increasing.

Published in:

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Date of Conference:

28-31 July 2008