Thermal management and testing of MCM with embedded chip in silicon substrate

In this paper the thermal management and testing of MCM with embedded chip in Si substrate was performed. Regarding the interconnection structure of the module, a benzocyclobutene (BCB) film covers the multichip modules as dielectric layer and Au soldered balls are utilized for multi-layer vertical interconnection. The thermal resistance and junction temperature are simulated and tested respectively. The results show that the thermal resistance is between 0.7degC/W and 1degC/W dependent on the use of a additional heat sink and the optimization of the parameters.