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In this paper the thermal management and testing of MCM with embedded chip in Si substrate was performed. Regarding the interconnection structure of the module, a benzocyclobutene (BCB) film covers the multichip modules as dielectric layer and Au soldered balls are utilized for multi-layer vertical interconnection. The thermal resistance and junction temperature are simulated and tested respectively. The results show that the thermal resistance is between 0.7degC/W and 1degC/W dependent on the use of a additional heat sink and the optimization of the parameters.
Date of Conference: 28-31 July 2008