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Thermal management and testing of MCM with embedded chip in silicon substrate

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3 Author(s)
Fei Geng ; ShangHai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China, Changning Road 865 ; Jia-jie Tang ; Le Luo

In this paper the thermal management and testing of MCM with embedded chip in Si substrate was performed. Regarding the interconnection structure of the module, a benzocyclobutene (BCB) film covers the multichip modules as dielectric layer and Au soldered balls are utilized for multi-layer vertical interconnection. The thermal resistance and junction temperature are simulated and tested respectively. The results show that the thermal resistance is between 0.7degC/W and 1degC/W dependent on the use of a additional heat sink and the optimization of the parameters.

Published in:

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Date of Conference:

28-31 July 2008