By Topic

Novel low-temperature micro-insert bonding technology for 3D package

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Po Xu ; Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai ; Anming Hu ; Zhuo Chen ; Ming Li
more authors

In this paper, a novel low-temperature micro-insert bonding technology for 3D package has been reported. Nickel microcone arrays (MCA) fabricated on the bonding pad was used as the under bump metallization (UBM). The bonding temperature is below the melting point of the solder. At certain temperature and pressure, the MCA inserted into the lead-free Sn-Ag-Cu solder bumps to achieve a good adhesion. The bonding of the joint is realized by the mechanical interlocking and the diffusion between the MCA and the solder. The nickel microcone arrays were prepared by directional electrodeposition (DEP) method on the Cu substrates in the solution with inorganic additives. And then hundreds of bumps were bonded on the substrates at different temperatures (150deg-210degC) and different bonding pressure (450, 560, 750 gf/p). Subsequently, ball shear testings were performed to evaluate the mechanical reliability and failure mode of the solder joints. After the shear testings, the microstructures of the fracture interfaces were investigated by SEM.

Published in:

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Date of Conference:

28-31 July 2008