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Heat transfer simulation of nanofluids in micro channel cooler

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5 Author(s)
Liu Hongjun ; Shanghai University, 224mail box, 149 Yan Chang RD., 20072, China ; Wang Xiaojing ; Zhang Minliang ; Zhang Wen
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Since the pioneering work by Tuckerman & Pease, lots of publications about heat sink has been researched in the last decade. Many enhancements are proposed in order to increase the thermal conductivity of micro-channels including nanofluids, special shapes, and two phase flows. The nanofluid is a solid-liquid mixture which is composed of nanoparticles and a basic liquid. In this paper, the nanofluids with suspended multiwalled carbon nanotube and other metallic or nonmetallic particles are compared to enhance the heat transfer performance. The thermal resistance of the heat sink with nanofluids is simulated.

Published in:

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Date of Conference:

28-31 July 2008