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High density 3D integration

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1 Author(s)
Roy Yu ; IBM T.J. Watson Research center, P.O. Box 218, Yorktown Heights, NY 10598, USA

This paper discusses the current and future needs in continued CMOS scaling, reviews the status of the transfer and joining (TJ) technology for MCM-D and wafer level 3DI integration, and explores the opportunities of the TJ technology in the realm of the ldquoMore than Moorerdquo era.

Published in:

Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on

Date of Conference:

28-31 July 2008