We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Generalization of the Classical Method for Calculating Dynamic Hysteresis Loops in Grain-Oriented Electrical Steels

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Zirka, S.E. ; Dept. of Appl. Phys. & Technol., Dnepropetrovsk Nat. Univ., Dnepropetrovsk ; Moroz, Y.I. ; Marketos, P. ; Moses, A.J.
more authors

We have studied the ability of two one-dimensional (1-D) time-stepping models, both based on the concept of magnetic viscosity, to reproduce dynamic loops and losses in grain-oriented (GO) electrical steels under arbitrary magnetization regimes. We found that GO steels (0.3 mm thick) can be modeled quite accurately at magnetizing frequencies up to 200 Hz by a thin sheet representation, which is applied to a bulk material. At higher frequencies, acceptable results can be obtained through a finite-difference solver of a 1-D penetration equation whose applicability to GO steels can be explained in terms of domain wall bowing. Because of the inertial effect introduced by the magnetic viscosity, the average error in the loss prediction is reduced from 40% for the conventional classical method to 5% for the methods we studied. We demonstrated the accuracy of the models using two GO steels whose losses and B-H characteristics were measured by computer-controlled Epstein and single-sheet testers.

Published in:

Magnetics, IEEE Transactions on  (Volume:44 ,  Issue: 9 )