By Topic

A MEMS Inertia Switch With Bridge-Type Elastic Fixed Electrode for Long Duration Contact

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Zhuoqing Yang ; Res. Inst. of Micro/Nanometer Sci. & Technol., Shanghai Jiao Tong Univ., Shanghai ; Guifu Ding ; Haogang Cai ; Xiaolin Zhao

A multilayer structural inertia microswitch with a bridge-type elastic fixed electrode for long duration contact has been designed and fabricated based on surface micromachining technology. The microswitch mainly consists of a suspended thick proof mass as a movable electrode and two parallel elastic beams with holes as a fixed electrode. The proof mass is designed to be much thicker than attached snake spring section. As a new type of fixed electrode, the bridge-type elastic beams can effectively improve the contact of the microswitch. The packaged microswitch (3.2 times 2.1 times1.3 mm3) has been tested and characterized by a dropping hammer system. The response time and the contact time of the microswitch are about 0.25 ms and 12 mus, respectively, when 100 g acceleration is applied, which indicates a better contact effect than current reported switches. Dependence of the contact time on the thickness of the parallel beam under applied acceleration of 100 g has been discussed. The contact time increases as the thickness of the parallel elastic beam decreases. The test data have an agreement with dynamic finite element simulation results.

Published in:

Electron Devices, IEEE Transactions on  (Volume:55 ,  Issue: 9 )