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Heat dissipation due to long interconnects in integrated circuits

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4 Author(s)
Gnidzinska, K. ; Technical University of ¿ód¿, POLAND ; Kubiak, K. ; Napieralski, A. ; De Mey, G.

Thermal and time delay aspects of long interconnect lines have been investigated. Two technologies, 0.35μm and 65nm, have been compared. To design a modern integrated circuit we need to focus on very long interconnects too in order to achieve the expected frequency and signal synchronization. Introducing buffers along the line helps to spread the heat production more homogenously but consumes extra power and chip area and it also affects the time delay.

Published in:

Mixed Design of Integrated Circuits and Systems, 2008. MIXDES 2008. 15th International Conference on

Date of Conference:

19-21 June 2008