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Modern electronic circuits require innovative thermal design and management solutions throughout all their design phases; starting from their conception to the final application. These novel solutions should provide both the designer and the user with the possibility to optimize the design, create adequate thermal models or perform on-line temperature monitoring of a circuit. This particular paper presents the design of a test ASIC equipped with various features whose purpose is to investigate the feasibility of different solutions for structure thermal testing, modelling and monitoring. All the components are described in detail and selected problems related to their design are discussed.
Date of Conference: 19-21 June 2008