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The paper presents results of a point heating time (PHT) analysis for integrated circuits. The point heating time is a time of temperature rise in any point of a circuit board, which is caused by a heat source freely placed on the chip. Authors present simulation results for calculation of the Point Heating Time for different materials and physical conditions of the integrated circuit. The method for obtaining the Point Heating Time value is presented with approximation of the RC electric model. Simulation results and a comparison with analytical values are presented for two scenarios: an active cooling and a heating of the chip. Analysis of Point Heating Time values based on a geometrical displacement of functional modules, which are equivalent to the heating source, are presented in the last section. PHT values are presented in a comparison with a distance from the heat source. Results are used to approximate polynomial function with a curve fitting method. The polynomial characteristic is going to be used with an asynchronous control of activity modules in the multicore processor model.