By Topic

Development of Thin-Film Liquid-Crystal-Polymer Surface-Mount Packages for Ka -Band Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Aihara, K. ; Electr. & Comput. Eng. Dept., Univ. of California at Davis, Davis, CA ; Chen, M.J. ; Anh-Vu Pham

In this paper, we present the design and development of thin-film liquid-crystal-polymer (LCP) surface-mount packages for Ka-band applications. The packages are constructed using multilayer LCP films and are surface mounted on a printed circuit board (PCB). Our experimental results demonstrate that the package feed-through transition including a PCB launch and bond wires achieve a return loss of better than -20 dB and an insertion loss of less than 0.4 dB around Ka-band. We achieve a measured port-to-port isolation of the package to be more than 45 dB across the Ka-band. We demonstrate the package feed-through circuit model by comparing the simulation of model and bare die measurement data to a packaged amplifier measurement. Finally, we report an LCP cavity that has a measured fine leak rate of 3.6 times 10-8 atmldrcc/s.

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:56 ,  Issue: 9 )