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Tamper Protection for Security Devices

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3 Author(s)
Paul, P. ; Comput. Lab., Univ. of Cambridge, Cambridge ; Moore, S. ; Simon Tam

Organic electronic materials are proposed to be used as a tamper protection grid for hardware security modules. Methods of designing a protection grid likely to be damaged in currently published depackaging techniques are derived. Organic protection layers are shown to be a feasible method of protecting hardware security modules against tampering.

Published in:

Bio-inspired Learning and Intelligent Systems for Security, 2008. BLISS '08. ECSIS Symposium on

Date of Conference:

4-6 Aug. 2008