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Novel process to pattern selectively dual dielectric capping layers using soft-mask only

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31 Author(s)

We are reporting for the first time on the use of simple resist-based selective high-k dielectric capping removal processes of La2O3, Dy2O3 and Al2O3 on both HfSiO(N) and SiO2 to fabricate functional HK/MG CMOS ring oscillators with 40% fewer process steps compared to our previous report [1]. Both selective high-k removal (using wet chemistries) and resist strip processes (using NMP and APM) have been characterized physically and electrically indicating no major impact on Vt, EOT, Jg, mobility and gate dielectric integrity (PBTI, TDDB and charge pumping).

Published in:

VLSI Technology, 2008 Symposium on

Date of Conference:

17-19 June 2008