Cart (Loading....) | Create Account
Close category search window
 

Novel and cost-efficient single metallic silicide integration solution with dual Schottky-barrier achieved by aluminum inter-diffusion for FinFET CMOS technology with enhanced performance

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

13 Author(s)
Lee, R.T-P. ; Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore ; Koh, A.T.-Y. ; Wei-Wei Fang ; Kian-Ming Tan
more authors

We have developed a novel and cost-efficient silicide integration solution to achieve a hole barrier height of 215 meV and electron barrier height of 665 meV simultaneously with a single metallic silicide based on aluminum inter-diffusion. It is proposed that aluminum diffuses into PtSi and forms an alloy, which lowers the electron barrier height of PtSi due to a change in the intrinsic PtSi workfunction. Additionally, we have integrated platinum germanosilicide with an ultra-low hole barrier height of 215 meV in P-FinFETs to provide a 21% enhancement in drive current performance, which is attributed to the 20% reduction in series resistance. We have also ascertained the compatibility of PtSiGe with laser thermal annealing for further performance enhancement.

Published in:

VLSI Technology, 2008 Symposium on

Date of Conference:

17-19 June 2008

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.