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Fabrication of CNT interconnect structures and active devices using laser beam manipulation and deposition

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6 Author(s)
M. H. Nai ; STMicroelectronics Asia Pacific Pte Ltd, 7 Serangoon North Avenue 5, Singapore 554812 ; S. Z. Wang ; A. M. Moo ; V. Vinciguerra
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A maskless and non-invasive technique based on optical trapping is used for the direct writing of CNT patterns on Si wafers. Interconnections and active transistor devices are fabricated at room temperatures using this technique.

Published in:

2008 2nd IEEE International Nanoelectronics Conference

Date of Conference:

24-27 March 2008