By Topic

DMA properties of semiconductive composites in power cables by dual filler system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hoon Yang ; Wonkwang Univ., Iksan ; Hyun-Hoo Kim ; Dae-Hee Park

This paper applied DMA to investigate the storage modulus, loss modulus, and Tandelta of nano-composite materials using a dual filler system that is fabricated by using different contents of CNT and CB for EEA. As a result, although the glass transition temperature of such nano-composite materials did not show changes in the temperature according to the change in applied contents, the storage modulus, loss modulus, and Tandelta increased according to the increase in applied contents. It is considered that the polymer chains were aligned according to the application of CNT, which has a large aspect ratio, as a reinforcing agent and there existed a certain crosslinking structure due to the increase of mechanical interlocking in resin.

Published in:

Condition Monitoring and Diagnosis, 2008. CMD 2008. International Conference on

Date of Conference:

21-24 April 2008