Skip to Main Content
On-resistance (Ron) degradation induced by avalanche breakdown is investigated in lateral double-diffused MOS transistors with different dosages of n-type drain drift (NDD) region. Ron degradation is caused by interface state and positive oxide-trapped charge created near the drain-side polygate edge. The device with a higher NDD dosage generates less interface state but more positive oxide-trapped charge, leading to a reduction in Ron degradation. Such a result reveals that increasing NDD dosage reduces avalanche-breakdown-induced Ron degradation.