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The numerical analysis has been carried out to figure out the performance of the thermoelectric micro-cooler for the hot spot cooling. The three dimensional model with the detailed geometry of the thermoelectric cooler was used. The hot spot was assumed to be located in the center of the silicon die which represents a microprocessor. The heat flux on the hot spot is much greater than that on the rest of area. The electric current applied to the micro-cooler was changed to figure out the performance of the cooler for the hot spot cooling. The result showed some useful data to design the thermoelectric micro-cooler for specific conditions given in the present study.